BAU 2015 from 19.-24. January 2015

On the worlds leading trade fair for architecture, materials and systems, which is taking place from 19. - 24. January 2015, the ESSMANN GROUP will again present impressively their future-proof solutions for automation of the building envelope.

In 2013 STG-BEIKIRCH and ESSMANN presented their group-wide portfolio including intelligent and integral solutions for future construction challenges around the building envelope on a 180m² booth. The international  professional audience experienced a powerful center of competence which is developing, producing and implementing solutions “from a single source”.

We are looking forward to your visit!



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